ForumMoore's Law: Predictor and Driver of the Silicon Era
References (11)
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Cited by (23)
Modeling and experimental investigation of monocrystalline silicon wafer cut by diamond wire saw
2023, Engineering Fracture MechanicsCitation Excerpt :Besides that, the electronic structure of chip merely uses the upper 1 % of wafer, and the other part only ensures the mechanical stability and thermal stability [6]. Therefore, reducing the sliced thickness of wafers is an important measure to improve material utilization and reducing manufacture cost [7,8]. However, there is no detailed theory that can be used to reveal the machining mechanism of the minimum thickness of monocrystalline silicon wafer cut by diamond wire saw.
The Pareto-optimal temporal aggregation of energy system models
2022, Applied EnergyCitation Excerpt :These trends increase system complexity and drive the need for spatially- and temporally-highly-resolved energy system models. In contrast, the growth rate of transistor density, which has been constant over the decades and is known as Moore’s Law [3,4], has been decreasing in recent years [5]. The conflict between fast-growing energy system models and a decreasing growth rate of computing power has driven the development of algorithms that focus on reducing the complexity of energy system models [6,7].
Typical periods or typical time steps? A multi-model analysis to determine the optimal temporal aggregation for energy system models
2021, Applied EnergyCitation Excerpt :Consequently, the complexity of energy systems has been steadily growing, which also requires more advanced energy system models. On the other hand, the growth rate of transistor density, known as Moore’s law [3,4], has declined in recent years [5]. Additionally, the growing energy demand of high-performance computing counteracts its benefits for achieving a carbon–neutral and energy-efficient future.
Performance assessment of thermoelectric self-cooling systems for electronic devices
2021, Applied Thermal EngineeringComparison of nanofluid wetting characteristics in untreated and superhydrophilic microgrooved heat pipes
2021, Case Studies in Thermal EngineeringCitation Excerpt :In the past decades, with the advances of information technology, microelectronic devices are becoming more and more miniaturized and integrated. Moore's Law indicates that the number of electronic components on an integrated circuit doubles approximately every 18–24 months [1]. The dense arrangement of electronic components leads to a significantly increase of heat flux, which will cause high temperature if the heat cannot be discharged in time.
A review of current challenges and trends in energy systems modeling
2018, Renewable and Sustainable Energy Reviews
R. Aaron Robison, M.D., Clinical Instructor, Department of Neurologic Surgery, University of Southern California